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Intel Core 2 Duo E6400 2.13GHz LGA 775 CPU SL9T9 + OEM Copper Core Heatsink 4Pin
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Intel Core 2 Duo E6400 2.13GHz LGA 775 CPU SL9T9 + OEM Copper Core Heatsink 4Pin
Price: US $22.95

RELIVE THE CONROE REVOLUTION: INTEL CORE 2 DUO E6400 2.13GHz + AUTHENTIC OEM COPPER-CORE HEATSINK FAN BUNDLE

Step back to the silicon watershed moment of 2006. When Intel launched the 65nm Conroe architecture, it effectively dethroned the power-hungry NetBurst era overnight, setting the benchmark for IPC efficiency and legendary overclocking headroom. Whether you are assembling a period-accurate Windows XP gaming rig to play Crysis and Half-Life 2 as they were intended, rebuilding a legacy DAW workstation, or preserving vintage computing history, this CPU and cooler combo is tested, verified, and ready to deploy.

HARDWARE & ARCHITECTURAL BREAKDOWN

Processor (CPU): Intel Core 2 Duo E6400

  • Socket: LGA 775 (Socket T)

  • sSpec Number: SL9T9

  • Core Architecture: Conroe (65nm lithography)

  • Core / Thread Count: 2 Cores / 2 Threads

  • Clock Frequency: 2.13 GHz Base Frequency

  • Front Side Bus (FSB): 1066 MHz

  • L2 Cache: 2MB Shared Advanced Smart Cache

  • Thermal Design Power (TDP): 65W

  • Instruction Set: 64-bit, Intel VT-x, SpeedStep, Execute Disable Bit

Cooling Solution: Genuine Intel OEM Copper-Slug Heatsink & Fan

  • Base Construction: Solid machined copper center core for rapid thermal draw directly from the IHS, surrounded by radial curved, bifurcated aluminum cooling fins.

  • Fan Type: 12VDC 0.60A high-static-pressure variable-speed fan.

  • Header: 4-Pin PWM connector (supports intelligent motherboard BIOS fan curves).

  • Mounting System: Original tool-less 4-point push-pin mechanism (all plastic retaining clips and locking pins intact, undamaged, and ready to lock).

BENCH TESTING & VERIFICATION PROTOCOL

Every component has undergone systematic bench-level testing:

  1. Socket POST: Verified on an LGA 775 testbed through cold boot into BIOS.

  2. Electrical Integrity: 100% of gold contact pads on the LGA grid array are clean and uncorroded; central decoupling capacitors are intact and undamaged.

  3. Thermal Contact: IHS surface is level and free of gouges or deep scratches.

  4. Fan Health: Bearing inspected for silent, smooth rotation without grinding or wobble; PWM fan throttling tested across varying RPM ranges.

SILICON ASSURANCE: HASSLE-FREE RETURNS

Retro hardware builds should be pure nostalgia, zero frustration. In accordance with Top Rated Plus service standards, this bundle comes backed by 30-day hassle-free returns:

  • Return Guidelines: Items must be returned in their original cosmetic and working condition with all components packaged using identical protective care.

  • Swift Resolution: Prompt, full refund issued upon return delivery and serial/sSpec verification.

LOGISTICAL RESPECT: ENTHUSIAST-TIER UNBOXING & PACKAGING

Components from this golden era deserve white-glove logistical handling. Your hardware travels with maximum armor:

  • Multi-Layer Impact Shielding: The CPU and copper-core heatsink are individually shrouded in continuous, thick-gauge bubble wrap to protect heatsink fins and mounting pins from lateral stress.

  • Heavy-Duty Void Fill: Internal space is packed with shredded bubble wrap to prevent shifting, rattle, or shock transfer.

  • Exterior Armor: The entire outer parcel is sealed and wrapped in heavy-duty builder's paper against external moisture, scuffs, and courier handling.

  • The Personal Touch: Every parcel includes a personalized, handwritten thank-you note from one tech enthusiast to another.

Shipping: We provide free shipping via USPS Ground Advantage.
Returns: We accept returns within 30 days of purchase if your CPU arrives damaged or defective in any way.
Please don't hesitate to contact us if you have any questions or concerns. Thank you for considering our listing!

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