Six lipstick-style twist-up tubes fortraining, classrooms, and parallel benches; solves >90% of pad replacementcases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
Description:
K5 PRO 6x10g delivers six individual twist-up tubes of our viscous,nonconductive thermal putty—widely used since 2013 for accessible, repeatablepad replacement. It spreads evenly, holds its shape, and maintains cohesivecontact between components and heat sinks on irregular surfaces, restoringconsistent thermal transfer without stacking pads.
The sixtube format is designed for teamsand training. Allocate one tube per technician or workstation, keep sealedspares for later, and track consumption per job. Compact tubes reduce benchclutter, travel well for onsite work, and help maintain material freshness overlong service cycles.
As a daily solution, K5 PRO covers the vastmajority of pad replacement scenarios on laptops, desktops, and consoles. Itspreads smoothly, holds its shape, and maintains cohesive contact betweencomponents and heat sinks—even across uneven surfaces and height variations—soyou can restore reliable heat transfer without hunting for exact padthicknesses.
Beyond standard repairs, K5 PRO also solvesthermaltransfer challenges in custom or compact builds. Use it to create acontrollable heat bridge from hot components to metal housings or frames indevices such as home routers, access points, LED light bars/panels, DVRs/NVRs,and singleboard computer enclosures. Users around the world have reported lowermemory temperatures, quieter fans, and improved stability after replacing agedor poorly sized pads, with consistent gains when dealing with mixed gap heightsand irregular interfaces. Store sealed, away from frost and dust; keep in acool, dry place to maintain long term stability.
Packet includes:
• 6 × 10 g twist-up tubes of K5 PRO thermal putty
• 1 × wooden applicator
• 1 × instruction leaflet
*Computer Systems Materials ScienceLaboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N.Karagiannis; MSAIJ, 2014).
Bullets:
• Replaces soft pads with a stable, shapeable interface that equalizes unevengaps so heat sinks seat properly and heat flows consistently across memory andpower stages.
• Packaging advantage – 6 × 10 g twist-up tubes: teamready allocation forclasses and multi station shops; supports inventory control, travel kits, andfreshness by opening only what you need.
• Fills up to 3 mm (≈1 mm optimal) and resists sag/pumpout; reliable at moduleedges, around screw posts, and across mixed height arrays where pad stacksoften fail.
• >5.3 W/m·K* thermal conductivity; −90 °C to 250 °C operating range;electrically nonconductive and serviceable during future teardowns.
• Effective for DIY heat bridging to metal housings in routers, LED bars,DVRs/NVRs, and compact embedded devices with limited airflow.
• K5 PRO is compatible with Apple iMac, Acer Nitro, ASUS ROG, MSI laptops,PlayStation 4, Nintendo Switch, Xbox One, and NVIDIA GeForce GTX 10series(e.g., GTX 1070/1080) boards.
