The Thermal Grizzly Minus Pad 8 is a premium thermal interface pad engineered for efficient heat transfer in demanding PC and electronics applications. Designed with a highly flexible and compressible silicone-based structure, it easily fills uneven gaps between components and heatsinks to ensure consistent thermal contact and reliable cooling performance. Ideal for use with GPUs, CPUs, VRAM modules, SSDs, motherboard chipsets, gaming consoles, laptops, and other heat-sensitive electronics, the Minus Pad 8 delivers dependable thermal conductivity while remaining electrically non-conductive for safe operation. Its ceramic silicone compound combined with nano-aluminum oxide particles allows for stable long-term performance even under heavy thermal loads. Key Features High thermal conductivity rated at 8.0 W/mK Excellent compressibility for uneven surfaces and tight tolerances Electrically insulating and non-conductive Flexible, easy-to-cut material for custom applications Reliable heat dissipation with low contact pressure RoHS compliant and environmentally friendly Available in multiple sizes and thicknesses for various cooling needs Technical Specifications Thermal Conductivity: 8.0 W/mK Temperature Range: -100 C to +250 C Material: Ceramic silicone compound with nano-aluminum oxide Electrical Conductivity: Non-conductive Hardness: 60 Shore 00